3D Integrated Circuits for Computing Market Size, Share, Trends, and Forecast (2025–2034): Industry Growth Analysis by Technology (Through-Silicon Via, Monolithic 3D IC, 3D Fan-Out Packaging, Silicon Interposer, Die-to-Die Bonding), Application (High-Performance Computing, AI & Machine Learning, Data Centers, Consumer Electronics, Automotive, IoT, Telecom), End-User Industry (IT & Telecom, Consumer Electronics, Healthcare, Automotive, Defense & Aerospace, Industrial Manufacturing), Integration Type (3D Stacked ICs, 3D Wafer-Level Packaging, 3D System-in-Package), Regional Insights, Competitive Landscape, and Market Opportunities